20+ Component Design Engineer Interview Questions and Answers

Verilog code to synthesize a black box with clock input and one output signal.

• Identify the functionality of the black box

• Write the code for the input and output signals

• Use Verilog modules to synthesize the circuit

Curve mesh and curve through mesh are two different methods of creating curves in UG NX software.

• Curve mesh creates a curve that passes through the mesh points, while curve through mesh creates a curve that follows the mesh points.

• Curve mesh is useful for creating curves that need to pass through specific points, while curve through mesh is useful for creating smooth curves that follow the mesh.

• Curve mesh can be created using the Mesh Curve command, while curve through mesh c...read more

Ductile materials exhibit plastic deformation under tensile loading, with stress and strain being proportional until the yield point.

• Ductile materials can undergo significant plastic deformation before failure

• Stress and strain are proportional until the yield point

• After the yield point, the material experiences strain hardening

• Ultimate tensile strength is the maximum stress a material can withstand before failure

• Elongation at break is the amount of strain a material can under...read more

NAND and NOR structures are logic gates used in digital circuits. Their sizing varies based on the loads they need to drive.

• NAND and NOR gates are fundamental building blocks in digital circuit design.

• The size of NAND and NOR gates is determined by the number of inputs and the loads they need to drive.

• For NAND gates, the size of the transistors in the pull-up network is increased to handle larger loads.

• For NOR gates, the size of the transistors in the pull-down network is inc...read more

Timing analysis changes for violating hold time and set up time constraints.

• For violating hold time constraint, the circuit needs to be redesigned to increase the delay of the data path.

• For violating set up time constraint, the circuit needs to be redesigned to decrease the delay of the data path.

• Hold time violations can be resolved by inserting additional flip-flops or increasing the clock-to-Q delay.

• Set up time violations can be resolved by reducing the propagation delay or...read more

Pipe flows, stress distribution, divergence, and vortex flow are all related to fluid mechanics.

• Pipe flows refer to the movement of fluids through pipes or channels.

• Stress distribution refers to the way stress is distributed throughout a fluid.

• Divergence is the measure of how much a fluid is spreading out or becoming more diffuse.

• Vortex flow is a type of fluid flow where the fluid rotates around a central axis.

• These concepts are important in designing components that involve ...read more

Static timing analysis involves calculating timing constraints in circuits with flip-flops and latches to ensure correct operation.

• Static timing analysis checks timing paths between flip-flops and latches.

• Time borrowing allows a latch to hold data longer than its clock period.

• Example: If FF1 outputs to a latch, and the latch has a delay, ensure FF1's setup time is met.

• Consider clock skew and latch delay when calculating timing paths.

• Use equations like T_clk + T_latch < T_setu...read more

Determine the heavy coin among 9 coins in the fewest number of tries.

• Divide the 9 coins into three groups of 3 coins each.

• Weigh any two groups against each other.

• If one group is heavier, weigh two coins from that group against each other.

• If they are equal, the remaining coin is the heavy one.

• If one coin is heavier, it is the heavy coin.

• If the initial weighing is balanced, the heavy coin is in the third group.

• Weigh two coins from the third group against each other to find the ...read more

Casting is a manufacturing process in which a liquid material is poured into a mold and allowed to solidify.

• Types of casting include sand casting, investment casting, die casting, and continuous casting.

• Sand casting involves creating a mold from sand and pouring the molten metal into it.

• Investment casting involves creating a wax pattern and coating it in ceramic before pouring in the molten metal.

• Die casting involves injecting molten metal into a mold under high pressure.

• Cont...read more

Runout is the deviation of a rotating component from its ideal axis, while total runout is the maximum amount of runout in any direction.

• Runout is a measure of how much a rotating component deviates from its ideal axis

• Total runout is the maximum amount of runout in any direction

• Runout can be caused by factors such as manufacturing defects, wear and tear, or misalignment

• Total runout is important in ensuring that a rotating component operates smoothly and efficiently

• Total runou...read more

Hot and cold chamber casting is a process used to cast metals with different melting points.

• Hot chamber casting is used for metals with low melting points like zinc and magnesium

• Cold chamber casting is used for metals with high melting points like aluminum and copper

• In hot chamber casting, the metal is melted in the casting machine itself

• In cold chamber casting, the metal is melted in a separate furnace and then transferred to the casting machine

• Both processes involve injecti...read more

Transistor level designs involve using transistors to create simple logic gates.

• Transistors can be used to create logic gates such as AND, OR, and NOT gates.

• In an AND gate, two transistors are connected in series.

• In an OR gate, two transistors are connected in parallel.

• In a NOT gate, a single transistor is used.

• Logic gates can be combined to create more complex circuits.

Parameters of design refer to the specific factors that must be considered when creating a product or system.

• Parameters can include things like size, weight, materials, and functionality.

• Design parameters are often determined by the intended use of the product or system.

• Parameters may also be influenced by factors such as cost, safety, and environmental impact.

• For example, when designing a car, parameters might include the size and shape of the vehicle, the type of engine and...read more

Gates can be represented using arithmetic operations like AND, OR, NOT, XOR, etc.

• AND gate can be represented using multiplication

• OR gate can be represented using addition

• NOT gate can be represented using subtraction

• XOR gate can be represented using modulo operation

• Arithmetic operations can be used to design complex logic circuits

Cylindricity is the roundness of a cylinder while runout is the deviation of a rotating part from its axis.

• Cylindricity is a 2D measurement while runout is a 3D measurement.

• Cylindricity is measured using a cylindrical gauge while runout is measured using a dial gauge.

• Cylindricity is important in manufacturing cylindrical parts while runout is important in ensuring smooth rotation of parts.

• Examples of cylindricity include piston cylinders and drill bits while examples of runou...read more

Soft connect errors in LVS can be resolved by adjusting the connectivity rules and verifying the layout.

• Review the connectivity rules to ensure they are correctly defined

• Check for any missing or incorrect connections in the layout

• Verify the layout against the design to identify and fix any discrepancies

• Use debugging tools to pinpoint the source of the soft connect errors

The number of layers in UG nx varies depending on the design requirements.

• The number of layers can range from 2 to over 100 depending on the complexity of the design.

• The layers can be used for different purposes such as signal routing, power distribution, and ground planes.

• The number of layers can also affect the cost and manufacturing process of the design.

• Examples of layer configurations include 2-layer, 4-layer, 6-layer, and 8-layer designs.

Collaterals in PDK refer to additional files and documents that provide information and support for the Process Design Kit.

• Collateral files may include documentation on process technology, design rules, device models, and simulation parameters

• These collaterals help designers understand and utilize the PDK effectively

• Examples of collaterals in PDK are process design rules (PDR), technology files, and layout design guidelines

The design flow for chip development involves several stages, including specification, architecture, design, verification, and manufacturing.

• Specification: Define the requirements and functionality of the chip.

• Architecture: Determine the high-level structure and components of the chip.

• Design: Create the detailed circuitry and layout of the chip.

• Verification: Test and validate the chip design for functionality and performance.

• Manufacturing: Fabricate the chip using semiconduct...read more

A MOS capacitor can be built by creating a metal-oxide-semiconductor structure.

• Start by depositing a layer of oxide on a silicon substrate

• Then deposit a layer of metal on top of the oxide

• Finally, connect the metal layer to a terminal for the capacitor

A domino logic circuit is a type of digital circuit that uses a chain of inverters to propagate a signal.

• A domino logic circuit consists of a chain of inverters connected in series.

• The output of each inverter is connected to the input of the next inverter.

• The input signal is applied to the first inverter in the chain.

• The output of the last inverter in the chain is the output of the circuit.

• Domino logic circuits are faster than static CMOS circuits but consume more power.

GD&T stands for Geometric Dimensioning and Tolerancing.

• It is a system used to define and communicate engineering tolerances and dimensions.

• It ensures that parts are manufactured to the correct size and shape, and fit together properly.

• GD&T uses symbols and annotations to convey information about the part's geometry, such as flatness, perpendicularity, and concentricity.

• It is commonly used in industries such as aerospace, automotive, and manufacturing.

• GD&T is important for ens...read more

Parasitics of a device refer to unwanted electrical properties that affect its performance.

• Parasitics include resistance, capacitance, and inductance in a device.

• They can cause signal delays, power losses, and interference.

• Examples of parasitics are stray capacitance in a PCB trace or resistance in a wire.

• Minimizing parasitics is crucial for optimizing device performance.

I designed a component for a new smartphone model.

• Developed a compact and efficient component for a smartphone

• Collaborated with a team of engineers to ensure compatibility and functionality

• Performed extensive testing and analysis to optimize performance

• Implemented design changes based on feedback and requirements

• Ensured compliance with industry standards and regulations