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Texas Instruments DFT Engineer Interview Questions and Answers

Updated 29 Nov 2022

Texas Instruments DFT Engineer Interview Experiences

1 interview found

DFT Engineer Interview Questions & Answers

user image Anonymous

posted on 29 Nov 2022

I applied via Referral and was interviewed in May 2022. There was 1 interview round.

Round 1 - Technical 

(5 Questions)

  • Q1. Problems I have faced and how it was solved like drc, simulation issues etc.
  • Q2. Loc,los, loes . Questions on pipeline logic. Div by 3 Freq clock generator.
  • Q3. Circuit was drawn and I was asked what inputs will create the scenario for s@ 0 s@1 faults.
  • Ans. 

    Identifying inputs for s@0 and s@1 faults involves analyzing circuit behavior under specific conditions.

    • s@0 fault occurs when a signal is stuck at logic 0; inputs must force the output to 0 regardless of intended logic.

    • Example: For an AND gate, if both inputs are 1, but the output is forced to 0, it indicates an s@0 fault.

    • s@1 fault occurs when a signal is stuck at logic 1; inputs must force the output to 1 regardless o...

  • Answered by AI
  • Q4. Questions on edt, 1 hot masking. Lock-up latches explanation with drawings
  • Q5. Coverage gaps, wrapper cell issues. Issues faced in post silicon
  • Ans. 

    Issues faced in post silicon for DFT Engineer

    • Coverage gaps can occur due to incomplete testing of certain functionalities

    • Wrapper cell issues can arise due to incorrect placement or sizing of the cells

    • Post silicon issues can also include timing violations, power issues, and signal integrity problems

    • Debugging post silicon issues can be challenging and time-consuming

  • Answered by AI

Interview Preparation Tips

Interview preparation tips for other job seekers - Basics should be good and know your work thoroughly.

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Interview experience
3
Average
Difficulty level
Hard
Process Duration
Less than 2 weeks
Result
Not Selected

I applied via Company Website and was interviewed in Apr 2024. There were 2 interview rounds.

Round 1 - One-on-one 

(2 Questions)

  • Q1. First round was with DFT Head. He seemed little arrogant. Asked me basic DFT questions like wrapper architecture, working and how flops will be handled in case of setup and hold.
  • Q2. He also asked me about work I have done
Round 2 - Technical 

(1 Question)

  • Q1. This was 3 hours back to back interview. In first round, All questions were on scan architecture, need of lockup latches, ATPG Basics, compression architecture etc. Second round was more on the challenges ...

Interview Preparation Tips

Interview preparation tips for other job seekers - Go very well prepared even on the topics you have not worked on.

DFT Engineer Interview Questions Asked at Other Companies

asked in Nvidia
Q1. Why can there be any coverage loss for 100% scan design?
asked in Nvidia
Q2. Can hold time or setup violations occur during stuck-at capture?
Q3. Given a circuit diagram, what inputs would create a scenario for ... read more
asked in Nvidia
Q4. What is the difference between T3 and T5 violations?
Q5. Coverage gaps, wrapper cell issues. Issues faced in post silicon

Intern Interview Questions & Answers

Intel user image Anonymous

posted on 18 Jul 2022

I applied via Campus Placement and was interviewed before Jul 2021. There were 3 interview rounds.

Round 1 - Technical 

(1 Question)

  • Q1. SDLC, digital circuit, rtl
Round 2 - Technical 

(1 Question)

  • Q1. Rtl coding verilog system verilog
Round 3 - HR 

(1 Question)

  • Q1. Introduction, hr policy company profile

Interview Preparation Tips

Interview preparation tips for other job seekers - Be strong in technical and know coding any programming language and scripting language. Know the things and concepts put in CV

Intern Interview Questions & Answers

Intel user image Anonymous

posted on 5 May 2021

I applied via Campus Placement and was interviewed in Apr 2021. There was 1 interview round.

Interview Questionnaire 

1 Question

  • Q1. Vlsi design flow, sta, perl programming, puzzle

Interview Preparation Tips

Interview preparation tips for other job seekers - Interviewer were polite

Intern Interview Questions & Answers

Intel user image M Shunmuga Priya

posted on 5 Jul 2021

Interview Questionnaire 

1 Question

  • Q1. Basics of digital electronics

Intern Interview Questions & Answers

Intel user image Anonymous

posted on 3 Apr 2021

I applied via Campus Placement and was interviewed in Mar 2021. There was 1 interview round.

Interview Questionnaire 

1 Question

  • Q1. 1.1. What is difference between combination logic circuit and sequential combination logic? 2. What is the difference between synchronous reset and asynchronous reset? 3. Why we used FSM ? 4. Differenc...
  • Ans. 

    Overview of digital circuit concepts and design principles in electronics.

    • Combination Logic Circuit: Output depends only on current inputs (e.g., adders, multiplexers).

    • Sequential Logic Circuit: Output depends on current inputs and past states (e.g., flip-flops, counters).

    • Synchronous Reset: Reset signal is synchronized with the clock; changes occur at clock edges.

    • Asynchronous Reset: Reset signal can change the state at ...

  • Answered by AI

Interview Preparation Tips

Interview preparation tips for other job seekers - Mainly focus on basics . For example digital electronics, Digital vlsi Design, Verilog .

Texas Instruments HR Interview Questions

38 questions and answers

Q. Tell me about a time you overcame an obstacle.
Q. Explain the projects listed on your resume.
Q. Introduce yourself.

Intern Interview Questions & Answers

Intel user image Anonymous

posted on 5 May 2018

I applied via Campus Placement

Interview Questionnaire 

2 Questions

  • Q1. Extensive discussion on minor projects. I had one in wireless communication and was asked technical questions based on my description of the project work.
  • Ans. 

    Developed a wireless communication project focusing on signal processing and data transmission efficiency.

    • Implemented a frequency modulation technique to enhance signal clarity.

    • Utilized MATLAB for simulating communication channels and analyzing performance metrics.

    • Conducted experiments to measure the impact of environmental factors on signal strength.

    • Collaborated with a team to design a prototype for real-time data tra...

  • Answered by AI
  • Q2. Questions on digital logic design. I was asked to write an FSM for a problem statement. This was followed by some basic questions on data structures and algorithms, like tree traversal etc. (Don't worry if...

Interview Preparation Tips

Round: Resume Shortlist
Experience: Shortlisting of candidates based on UG CGPA from CS, EC, EE and IT branches.

General Tips: Be thorough with your basics. A good command over digital logic and computer architecture is a plus.
Skills: Communication, Problem Solving, Analytical Skills
Duration: <1 week
Are these interview questions helpful?

I applied via Campus Placement and was interviewed in Aug 2021. There were 3 interview rounds.

Interview Questionnaire 

1 Question

  • Q1. Verilog n digital

Interview Preparation Tips

Interview preparation tips for other job seekers - It's quite good. Had asked about microprocessor also
Interview experience
5
Excellent
Difficulty level
Moderate
Process Duration
-
Result
Selected Selected

I applied via Campus Placement and was interviewed before Jul 2022. There were 3 interview rounds.

Round 1 - Resume Shortlist 
Pro Tip by AmbitionBox:
Keep your resume crisp and to the point. A recruiter looks at your resume for an average of 6 seconds, make sure to leave the best impression.
View all tips
Round 2 - Aptitude Test 

Written test consist of digital electronics, coding section, verilog and aptitude questions

Round 3 - Technical 

(2 Questions)

  • Q1. In Technical interview, They asked what ever skills you have mentioned in your resume..not more than that.
  • Q2. Flip flop conversion, c coding logic test, RTL etc

Intern Interview Questions & Answers

Qualcomm user image Pichakayala Sannajajula

posted on 2 Dec 2022

Interview experience
4
Good
Difficulty level
Moderate
Process Duration
6-8 weeks
Result
Selected Selected

I applied via Company Website and was interviewed in Jun 2022. There were 3 interview rounds.

Round 1 - Resume Shortlist 
Pro Tip by AmbitionBox:
Keep your resume crisp and to the point. A recruiter looks at your resume for an average of 6 seconds, make sure to leave the best impression.
View all tips
Round 2 - Coding Test 

Basic Verilog coding and digital design questions

Round 3 - HR 

(2 Questions)

  • Q1. Details on education, grades, career interests...etc If we offer you a permanent role after successful internship are you willing to join
  • Q2. What are your grades

Interview Preparation Tips

Interview preparation tips for other job seekers - Please refresh your digital design concepts. Flip flops, FSMs...etc

Texas Instruments Interview FAQs

How many rounds are there in Texas Instruments DFT Engineer interview?
Texas Instruments interview process usually has 2 rounds. The most common rounds in the Texas Instruments interview process are Resume Shortlist and Technical.
How to prepare for Texas Instruments DFT Engineer interview?
Go through your CV in detail and study all the technologies mentioned in your CV. Prepare at least two technologies or languages in depth if you are appearing for a technical interview at Texas Instruments. The most common topics and skills that interviewers at Texas Instruments expect are DFT, Physical Design, Automotive, JTAG and SOC.
What are the top questions asked in Texas Instruments DFT Engineer interview?

Some of the top questions asked at the Texas Instruments DFT Engineer interview -

  1. Circuit was drawn and I was asked what inputs will create the scenario for s@ 0...read more
  2. Coverage gaps, wrapper cell issues. Issues faced in post sili...read more
  3. Problems I have faced and how it was solved like drc, simulation issues e...read more

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